Besi Projects 2025 Surge in Hybrid Bonding Demand Amid Q3 Order Shortfall

The Dutch chipmaking supplier anticipates a rise in demand for its hybrid bonding systems despite recent shipment delays and market weaknesses.

Besi's third-quarter orders fell 18% quarter-on-quarter, missing estimates due to delays and market challenges.
The company reported strong growth in AI and computing markets but faced ongoing weakness in automotive and Chinese sectors.
Besi plans to double its cleanroom facilities in Malaysia to accommodate the expected increase in hybrid bonding demand in 2025.
Despite shipment delays affecting fourth-quarter forecasts, Besi received substantial orders from both existing and new customers.
Analysts attribute the order delays to excess capacity built during the pandemic and supply chain adjustments.