Biden-Harris Administration and Amkor Technology to Bolster U.S. Semiconductor Packaging

$400 million in CHIPS Act funding supports a new $2 billion facility in Arizona, creating 2,000 jobs and enhancing domestic chip production.

The Biden-Harris Administration has signed a preliminary memorandum with Amkor Technology to provide $400 million in funding under the CHIPS and Science Act.
Amkor's new facility in Peoria, Arizona, will be the largest advanced semiconductor packaging site in the U.S., supporting high-performance computing and AI.
The project is expected to create 2,000 jobs and strengthen the domestic semiconductor supply chain.
Amkor plans to utilize cutting-edge 2.5D technology crucial for AI and high-performance computing applications.
The facility will support companies like TSMC, Apple, and GlobalFoundries in packaging and testing chips domestically.