Intel Delays Ohio Semiconductor Project to Late 2026
Citing market challenges and funding delays, Intel postpones its $20 billion manufacturing initiative, underscoring its commitment to U.S. semiconductor capacity.
- Intel has postponed the completion of its $20 billion Ohio semiconductor manufacturing project to late 2026, citing market challenges and delays in receiving CHIPS Act subsidy cash.
- The project, initially set to start chip production in 2025, has not seen recent changes to its construction pace or timelines despite the delay.
- Intel remains committed to the Ohio project, emphasizing its role in bolstering U.S. semiconductor manufacturing capacity and reducing reliance on overseas production.
- The delay is partly attributed to the slow rollout of the $53 billion CHIPS Act funding, aimed at revitalizing the U.S. semiconductor industry.
- Intel's decision reflects broader industry trends, with other companies also facing delays in their U.S. fab projects due to market dynamics and funding issues.
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