Revolutionary Micro-Cooling Chip to Enhance AI-Driven Mobile Devices

xMEMS introduces the XMC-2400 µCooling chip, promising active cooling for ultra-thin smartphones and tablets.

The XMC-2400 µCooling chip is a 1mm-thick, solid-state fan designed for ultramobile devices.
It actively cools components, preventing overheating in AI-intensive applications.
The chip can move 39 cubic centimeters of air per second and operates silently.
xMEMS plans to sample the chip to manufacturers in early 2025, with devices expected by 2026.
The technology could also be applied to ultrathin laptops, VR headsets, and other compact electronics.