Scientists Develop Hybrid Materials Combining Stiffness and Thermal Insulation
New two-dimensional hybrid organic-inorganic perovskites offer unique properties for electronic device protection
- Researchers engineered materials that are both stiff and effective at insulating against heat.
- These materials are based on two-dimensional hybrid organic-inorganic perovskites (2D HOIPs).
- The team discovered that adding benzene rings to the organic layers increases stiffness and thermal insulation.
- Introducing chirality into the organic layers allows for maintaining properties while altering composition.
- The findings provide a new pathway for creating materials with tailored properties for various applications.
ScienceDaily 