TSMC Explores Advanced Chip Packaging Facility in Japan

The move could significantly bolster Japan's semiconductor industry and align with global AI-driven demand.

TSMC is considering establishing an advanced packaging facility in Japan, potentially enhancing Japan's semiconductor industry revival efforts.
The company plans to introduce its CoWoS packaging technology to Japan, currently utilized for high-performance processors by major tech firms.
TSMC's expansion in Japan includes building two fabs, with investments expected to exceed $20 billion, alongside increasing CoWoS capacity in Taiwan.
Global demand for advanced semiconductor packaging is surging, driven by AI processors like Nvidia's H100, prompting TSMC to double its CoWoS output by year's end.
The potential expansion in Japan aligns with TSMC's strategy to meet global demands for advanced chip production and packaging, amidst a booming AI sector.