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6h ago

Xiaomi Unveils Custom 3nm Chip and Extends Qualcomm Partnership

Xiaomi's XRING O1 chipset debuts alongside a renewed multi-year Qualcomm agreement, signaling a dual strategy of in-house innovation and external collaboration.

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Lei Jun, co-founder and CEO of Xiaomi, speaks in Beijing on May 22, 2025

Overview

  • Xiaomi launched its first custom 3nm chipset, the XRING O1, powering the Xiaomi 15S Pro smartphone and Pad 7 Ultra tablet, with performance claims rivaling Apple's A18 Pro.
  • The XRING O1 features a 10-core CPU and 16-core GPU, utilizing TSMC's advanced 3nm process with 19 billion transistors for high efficiency and power.
  • Xiaomi and Qualcomm signed a multi-year agreement to continue equipping Xiaomi's premium smartphones with Snapdragon 8-series processors, including the upcoming Snapdragon Elite 2.
  • Qualcomm confirmed its next Snapdragon Summit will take place earlier than usual, in September 2025, to accelerate device readiness for its next flagship chipset.
  • Xiaomi's dual approach aims to balance reliance on Qualcomm with increased self-sufficiency through proprietary silicon, aligning with broader Chinese tech trends to reduce dependency on foreign suppliers.